Dicing Blades
Dicing Blades, For High-Precision Slicing And Dicing Of Soft To
Hard Materials Of Many Different Types And Elements
Our blade technologies are designed and developed for
high-precision slicing and dicing of soft to hard materials of many
different types and elements, that are used in hard disk drive,
optical, and semiconductor applications. Blades are produced with
state-of-the-art manufacturing techniques to ensure
tightly-controlled dimensional and thickness tolerances.
Offerings include hub and hubless style blades. Our hubless style
blades come in a selection of different bond types, ranging from
electroformed, metal (sintered), resin, and vitrified. In addition,
our cutting blade diamond compositions and bonds can be customized
to best fit your application.
Electroformed Bond Hub Blade
Developed for silicon and compound semiconductor wafer cutting.
Proprietary electroforming and diamond distribution processes
provide a consistent blade cut quality with reduced backside
chipping.
Please contact us for additional details.
Advantages
Variety of different grit concentrations
Bond hardness adjustability
Precise diamond distribution control
Blade thicknesses down to 15um available
Applications
Silicon and compound semiconductor wafers
Electroformed Bond Hubless Blade
Advanced electroformed manufacturing process capable of producing
ultra-thin blades with high strength and stiffness characteristics.
Blades keep their shape and provide longer life.
Advantages
Wide selection of blade options
Proprietary thin-blade technology
Bond customization options
Blade thicknesses down to 25um available
Applications
Ceramics, magnetic materials, PCB, silicon, and etc.
Metal Bond Hubless Blade
Formulated sintered metal bond matrix designed to hold and retain
diamond grains to increase blade longevity. Blades have a low wear
resistance when compared to standard formulations and help to
reduce defects such as slanted-kerf.
Advantages
Wide selection of blade options
Special metal bond matrix formulation
Excellent rigidity and cut quality
Blade thicknesses down to 45um available
Applications
BGA, CSP, optical, sapphire, and etc.
Resin Bond Hubless Blade
Resin bond matrix developed to reduce the occurrence of diamond
grain deformation and aid in new diamond exposure. Blades provide
good cutting efficiency and quality on hard and brittle materials.
Advantages
Wide selection of blade options
Bond matrix allows for high speed processing
Improved cut quality on hard materials
Blade thicknesses down to 50um available
Applications
Hard and brittle materials, IR filter, optical, QFN, splitter, and
etc.
Vitrified Bond Hubless Blade
Vitrified bond developed with high rigidity to enhance the
straightness of the entry cut and to provide precise cutting during
high-loading applications. Blades work well on hard materials, such
as crystal and sapphire.
Please contact us for additional details.
Advantages
Wide selection of blade options
Excellent for high-loading and hard materials
Enhanced straight cutting capability
Blade thicknesses down to 70um available
Applications
Ceramic, crystal, and sapphire
